Hana ʻia nā mea hoʻohui Micro Match - papa palaoa, 236-K, 1660 mau kūlana i nā papa palaoa ʻole - J-Guang

ʻO ka wehewehe pōkole:

J-GUANG breadboard i ekolu ano: maʻamau solderless breadboard, malamalama solderless, hui breadboard. Loaʻa iā lākou ʻelua paʻi: pahu pahu a me ka pahu pahu, hiki iā mākou ke hoʻopaʻa i nā waiwai e like me nā koi o nā mea kūʻai aku. Hōʻikeʻike Dielectric Withstanding Voltage: AC 500V i kēlā me kēia minuke. Kū'ē Kū'ē: 1000MΩ Min Kū'ē Kū'ē: 100mΩ Max Temperature Range: -20 ° C ~ + 80 ° C Mea Insulator: Thermoplastic


Huahana Huahana

Huahana Huahana

Wikiō pili

Manaʻo manaʻo (2)

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Hana ʻia nā mea hoʻohui Micro Match - papa ʻai, 236-K, 1660 mau kūlana i nā papa palaoa solderless - J-Guang Detail:

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J-GUANG breadboard i ekolu ano: maʻamau solderless breadboard, malamalama solderless, hui breadboard. Loaʻa iā lākou ʻelua paʻi: pahu pahu a me ka pahu pahu, hiki iā mākou ke hoʻopaʻa i nā waiwai e like me nā koi o nā mea kūʻai aku.

Hōʻike

Dielectric Withstanding Voltage: AC 500V i kēlā me kēia minuke.

Kū'ē Kū'ē: 1000MΩ Min

Kū'ē Pili: 100mΩ Max

Kaulana Mahana: -20°C~+80°C

Mea waiwai

Insulator: Thermoplastic

JG236-K


Nā kiʻi kikoʻī huahana:

Hana ʻia nā mea hoʻohui Micro Match - papa palaoa, 236-K, 1660 mau kūlana i nā papa palaoa solderless - nā kiʻi kikoʻī J-Guang


Alakaʻi Huahana Pili:
Loaʻa i nā mea holo kaʻa kaʻa kaʻa a me nā ʻōlelo aʻoaʻo palekana i ka hoʻomaka ʻana o ka makahiki kula UCSB | Hoʻohui Zif
E ike a ike ia oe ma na alanui hooilo | Nūhou | Nā mea hoʻomanaʻo palekana alanui

Hana ʻia nā mea hoʻohui Micro Match - papa palaoa, 236-K, 1660 mau kūlana solderless breadboards - J-Guang, E hāʻawi ka huahana i nā wahi āpau, e like me: , , ,

  • 5 HokuMai -

    5 HokuMai -